专利名称：Encapsulated housing for dissipating heat
produced by electrical circuits
发明人：Jean C. Taverdet申请号：US06/731948申请日：19850508公开号：US04680673A公开日：19870714
摘要：A housing or box for dissipation of the heat produced by electrical circuits. Thehousing includes a metallic armature which has an upper portion with a hermetic recess inwhich are disposed the electrical circuits, and a lower portion for cooling with a coolingfluid. The cooling portion includes a single-piece metallic assembly in which are formedchannels and openings between the channels in such a way that a circulation network forthe cooling fluid is formed.
申请人：SOCIETE XERAM
代理机构：Oblon, Fisher, Spivak, McClelland & Maier
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