Encapsulating compositions ultra-pure, fused-silic

专利名称：Encapsulating compositions ultra-pure,

fused-silica fillers

发明人：Alpha, James William,Teter, Michael

Philip,Schermerhorn, Paul Maynard

申请号：EP88304192.3申请日：19880509公开号：EP0292174A2公开日：19881123

摘要：Compositions for encapsulating electronic components are provided whichcomprise a blend of a curable resin and an ultra-pure silica filler. The filler is composed offused silica granules which are prepared from a gel of a silicon-containing organiccompound, such as TEOS, and which have a uranium content of less than about 0.1 partsper billion and a thorium content of less than about 0.5 parts per billion. The

compositions can be readily manufactured in commercial quantities at reasonable costsand are particular well-suited for encapsulating components, such as, high density RAMs,which are sensitive to alpha particles.

申请人：Corning Glass Works

地址：Sullivan Park FR-212 Corning New York 14831 US

国籍：US

代理机构：Smith, Sydney

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