专利名称：MEMBRANE-LIMITED SELECTIVE
ELECTROPLATING OF A CONDUCTIVESURFACE
发明人：MAZUR, Stephen申请号：EP05852578.3申请日：20051111公开号：EP1817443A2公开日：20070815
摘要：This invention relates to processes and apparati for selectively electroplating ametal layer or layers into recessed topographic features on a conductive surface. Theprocesses and apparati of the invention are useful for fabricating metal circuit patterns,for example for creating copper interconnects between integrated circuit elementsembedded in a thin layer of dielectric material on the surface of a semiconductor wafer.
申请人：E.I. DUPONT DE NEMOURS AND COMPANY
地址：1007 Market Street Wilmington, Delaware 19898 US
国籍：US
代理机构：Matthews, Derek Peter
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