专利名称:SENSOR DEVICE AND METHOD FOR
MANUFACTURING SAME
发明人:Masahiro NAKAMURA申请号:US15537699申请日:20160212
公开号:US20180006214A1公开日:20180104
专利附图:
摘要:The present invention relates to a sensor device which has high S/N andexcellent temperature characteristics. A sensor device has a semiconductor substrate, afirst metal wiring layer provided on the semiconductor substrate, a first insulating layer
provided on the first metal wiring layer, a compound semiconductor sensor elementprovided on the first insulating layer, a second metal wiring layer provided on thecompound semiconductor sensor element and the first insulating layer, and a secondinsulating layer provided on the second metal wiring layer. A third insulating layer isprovided between the first metal wiring layer and the second metal wiring layer, and thecompound semiconductor sensor element is provided in the third insulating layer.
申请人:ASAHI KASEI MICRODEVICES CORPORATION
地址:Tokyo JP
国籍:JP
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