FORMATION OF DIAMOND PARTICLE INTERCONNECTS

专利名称：FORMATION OF DIAMOND PARTICLE

INTERCONNECTS

发明人：JERRY ZIMMER,DANIEL A. WORSHAM申请号：US09187363申请日：19981106

公开号：US20020045346A1公开日：20020418

专利附图：

摘要：Conductive diamond film regions on a substrate for establishing electricalcontact with a surface mount semiconductor package, or the like, is formed by heatingthe substrate base in a diamond film gas phase deposition reactor, then introducingmolecular hydrogen, a carbon bearing gas, and a dopant source into the reactor at atemperature sufficient to produce a conductive polycrystalline diamond layer. Then thepolycrystalline diamond layer is etched down to the substrate base in regions where nocontact will exist with the surface mount packages to define a desired pattern of

conductive polycrystalline diamond in regions of the packages where electrical contact isdesired. The substrate is then brought into pressure contact with a surface mountsemiconductor package, or the like.

申请人：ZIMMER JERRY,WORSHAM DANIEL A.

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