专利名称：Polyimide precursor solution composition发明人：Tetsuji Hirano,Toru Kidosaki申请号：US13125451申请日：20091028公开号：US09334368B2公开日：20160510
摘要：A first polyimide precursor solution composition contains: (A) a polyamic acid;(B) a carboxylic acid compound having at least three pairs of carboxyl groups within itsmolecule or an esterified product thereof; and (D) a solvent. A second polyimideprecursor solution composition contains the components (A), (B), and (D) of the firstpolyimide precursor solution composition and additionally containing (C) a carboxylic acidcompound having two pairs of carboxyl groups within its molecule or an esterifiedproduct thereof. A third polyimide precursor solution composition contains thecomponents of the second polyimide precursor solution composition, wherein thepolyamic acid (A) is a polyamic acid having a specific structure.
申请人：Tetsuji Hirano,Toru Kidosaki
地址：Chiba JP,Chiba JP
国籍：JP,JP
代理机构：Young & Thompson
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